Compliance with the standard of JEDEC eMMC 5.1 Version, and support SDR/DDR/HS200/HS400 interface modes.
Support SLC caching.
Support FFU firmware upgrade.
High-performance, high-quality solutions oriented to OEM partners.
RM550 supports HS400 interface mode and SLC caching. Moreover, thanks to its originative firmware architecture and intelligent GC algorithm, firmware maximizes software/hardware performance under both heavy and light loads, enabling industry-leading 320 MB/s in sequential read and 260 MB/s in sequential write speed.
With a sound quality assurance system, adopts mature mechanisms to control the quality throughout the product lifecycle. During R&D phase, RM550 has closed loop and adequacy of all problems encountered, so as to ensure excellent quality performance of products after mass production. RM550 has achieved mass production and has been proved meeting partners' demanding DPPM requirements in various application scenarios through rigorous market testing.
RM550 has gone through rigorous design reasoning, signal simulation, package reliability verification, protocol conformance testing, temperature shock testing, firmware reliability verification, and multi-generation platform compatibility testing from major manufacturers and demanding OEM import verification. These numerous intensive, multi-dimensional tests ensure that RM550 is an industry leader in terms of compatibility.
Product Series |
RM550 |
|
Capacity |
64 GB |
128 GB |
Model |
RETMHKG64GSBB |
RETMHKG128DBB |
Interface |
eMMC 5.1 |
eMMC 5.1 |
Sequential Read |
320 MB/s |
320 MB/s |
Sequential Write |
245 MB/s |
260 MB/s |
Random Read IOPS |
32K |
32K |
Random Write IOPS |
38K |
38K |
Clock Mode |
SDR/DDR/HS200/HS400 |
|
Operating Voltage |
VCC: 2.7 to 3.6 V, VCCQ: 1.7 to 1.95 V / 2.7 to 3.6 V |
|
Operating Temperature |
-25℃ to 85℃ |
|
Storage Temperature |
-40℃ to 85℃ |
|
Packaging Form |
BGA 153 Ball, 11.5 mm*13.0 mm*1.0 mm |