Advanced Techniques of Packaging and Testing

As one of the few manufacturers with in-house packaging and testing capabilities in flash memory industry, Union Memory has complete packaging design, simulation and reliability verification as well as advanced packaging/testing manufacturing capabilities. Through in-house R&D and innovation, Union Memory has mastered the core packaging and testing technique for large-capacity, high-density and ultra-thin system-level products, and has completed multiple iterations of products.

Wafer Grinding & Dicing

Union Memory is the first domestic enterprise introducing ultra-thin wafer processing technique in the packaging and testing industry, with grinding and dicing capacity of 3D Flash wafer thinner than 50um, owns core technique such as SDBG, Edge Trimming, and Laser Grooving for further processing of wafers to different sizes, with technique reaching the international advanced level.

3D Stacking Wafers

With the world's leading thimble-free stacking process, Union Memory has realized the stacking of ultra-thin wafers, and the single chip can accommodate a maximum of 32 memory chips, achieving TB-level capacity packaged products.
The final packaging thickness: The thickness of DDP (2-stack stacks) and QDP (4-stack DIE) products is less than 1.0mm; the thickness of ODP (8-stack DIE) product is less than 1.2mm; the thickness of HDP (16-stack DIE) is less than 1.4mm.

Linear Welding

Union Memory has welding processes for gold, silver and copper wires and more, with ultra-low arc technique and welding capacity for ultra-thin chip products.

Immersion Molding

Upgrading from casting molding to immersion molding makes the process of capsulation more stable. With ultra-thin substrate coping ability, it achieves high stacking, small-spacing packaging low pressure coping, products without pores, flow marks and punch lines; Moreover, it enables flexible adjustment of product thickness.

Testing

The aging of automatically packaged particles is tested with an in-house developed and proprietary testing system. With testing and development capabilities for special ATE testing machine in storage industry, Union Memory has established a big data testing system, supported end-to-end test data tracking, big data analysis and application capacities, and massively tested fixture usage monitoring capacity, laying a solid foundation for intelligent manufacturing and remote monitoring.

Advanced Techniques of Packaging and Testing

As one of the few manufacturers with in-house packaging and testing capabilities in flash memory industry, Union Memory has complete packaging design, simulation and reliability verification as well as advanced packaging/testing manufacturing capabilities. Through in-house R&D and innovation, Union Memory has mastered the core packaging and testing technique for large-capacity, high-density and ultra-thin system-level products, and has completed multiple iterations of products.
Wafer Grinding & Dicing

Union Memory is the first domestic enterprise introducing ultra-thin wafer processing technique in the packaging and testing industry, with grinding and dicing capacity of 3D Flash wafer thinner than 50um, owns core technique such as SDBG, Edge Trimming, and Laser Grooving for further processing of wafers to different sizes, with technique reaching the international advanced level.
3D Stacking Wafers

With the world's leading thimble-free stacking process, Union Memory has realized the stacking of ultra-thin wafers, and the single chip can accommodate a maximum of 32 memory chips, achieving TB-level capacity packaged products.
The final packaging thickness: The thickness of DDP (2-stack stacks) and QDP (4-stack DIE) products is less than 1.0mm; the thickness of ODP (8-stack DIE) product is less than 1.2mm; the thickness of HDP (16-stack DIE) is less than 1.4mm.
Linear Welding

Union Memory has welding processes for gold, silver and copper wires and more, with ultra-low arc technique and welding capacity for ultra-thin chip products.
Immersion Molding

Upgrading from casting molding to immersion molding makes the process of capsulation more stable. With ultra-thin substrate coping ability, it achieves high stacking, small-spacing packaging low pressure coping, products without pores, flow marks and punch lines; Moreover, it enables flexible adjustment of product thickness.
Testing

The aging of automatically packaged particles is tested with an in-house developed and proprietary testing system. With testing and development capabilities for special ATE testing machine in storage industry, Union Memory has established a big data testing system, supported end-to-end test data tracking, big data analysis and application capacities, and massively tested fixture usage monitoring capacity, laying a solid foundation for intelligent manufacturing and remote monitoring.