Compliance with the standard of JEDEC eMMC 5.1 Version, and support SDR/DDR/HS200/HS400 interface modes.
Supports SLC caching.
Supports FFU firmware upgrade.
High-performance, high-quality solutions oriented to OEM partners have been delivered to more than 10 million applications.
RM540 supports HS400 interface mode and SLC caching. Moreover, thanks to its originative firmware architecture and intelligent GC algorithm, firmware maximizes software/hardware performance under both heavy and light loads, enabling industry-leading 320 MB/s in sequential read and up to 240 MB/s in sequential write speed.
With a sound quality assurance system, Union Memory adopts mature mechanisms to control the quality throughout the product lifecycle. During R&D phase, Root Causes have been identified for all faults with RM540, and closed loop and adequacy have been verified, so as to ensure excellent quality performance of products after mass production. With the original quality prediction model, Union Memory can accurately predict the quality performance of the products after mass production. RM540 has delivered accumulative 10 millions of units and has been proved meeting partners' demanding DPPM requirements in various application scenarios through rigorous market testing.
RM540 has gone through rigorous design reasoning, signal simulation, package reliability verification, protocol conformance testing, temperature shock testing, firmware reliability verification, multi-generation platform compatibility testing from major manufacturers and demanding OEM import verification. These numerous intensive, multi-dimensional tests ensure that RM540 is an industry leader in terms of compatibility.
Product Series |
RM540 |
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Capacity |
32 GB |
64 GB |
128 GB |
Model |
RETMEDB32GSBB |
RETMEDB64GDBB |
RETMEDB128QBB |
Interface |
eMMC 5.1 |
eMMC 5.1 |
eMMC 5.1 |
Sequential Read |
300 MB/s |
320 MB/s |
320 MB/s |
Sequential Write |
150 MB/s |
230 MB/s |
240 MB/s |
Random Read IOPS |
9K |
9.4K |
9.4K |
Random Write IOPS |
31K |
38K |
38K |
Clock Mode |
SDR/DDR/HS200/HS400 |
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Operating Voltage |
VCC: 2.7 to 3.6 V, VCCQ: 1.7 to 1.95 V / 2.7 to 3.6 V |
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Operating Temperature |
-25℃ to 85℃ |
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Storage Temperature |
-40℃ to 85℃ |
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Packaging Form |
BGA 153 Ball, 11.5 mm*13.0 mm*1.0 mm |