Next-gen PCIe 5.0 high-speed interface enables a comprehensive performance leap
Sequential read/write up to 11,400/10,900 MB/s and 4KB random read/write up to 1,700K/1,150K IOPS
Fully compatible with leading OEM hardware and software standards
Easily handles high-load scenarios including large game loading, real-time 8K video editing, and AI computing

PCIe 5.0 delivers 50% performance uplift over PCIe 4.0
Support static/dynamic SLC write cache, handling sudden burst writes with ease

Support end-to-end data protection and SRAM/CPU ECC multiple error correction mechanisms to ensure comprehensive data security
Sustained, stable high performance with performance variance <5% under high loads — rock-solid reliability without stuttering

High-integration DRAM-less architecture with reduced number of crystal oscillators and DCDC modules for cost optimization
Multiple power-saving technologies including LTR, D3hot, and D3cold with superior energy efficiency
Support L1.2 low-power mode with power consumption as low as 3mW

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Model |
AM6D1 |
AM6D0 |
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|
Capacity |
512GB |
1TB |
2TB |
512GB |
1TB |
2TB |
|
Sequential read |
10700MB/ |
10700MB /s |
11400MB /s |
10200MB/s |
11300MB/s |
11300MB/s |
|
Sequential write |
8700MB/s |
10600MB/s |
10900MB/s |
6600MB/s |
10300MB/s |
10600MB/s |
|
Random read IOPS (4KB) |
850K |
1500K |
1600K |
700K |
1400K |
1700K |
|
Random write IOPS (4KB) |
1100K |
1150K |
1150K |
1100K |
1100K |
1100K |
|
Form factor |
M.2 2242/M.2 2280 |
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Dimensions |
M.2 2242: 42±0.15mm (L) × 22±0.15mm (W) × 2.38mm (H, max.) |
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Weight |
M.2 2242: Max. 3.8g |
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Power consumption |
L1.2: < 5 mW, Idle: < 50 mW, Active: < 150 mW |
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|
Bus interface |
PCIe Gen5 ×4 |
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|
NVMe standard |
NVMe 2.0 |
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Temperature |
Operating: 0℃ to 70℃ |
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Humidity |
5% to 95%, non-condensing |
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MTBF |
2 million hours |
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|
Shock |
Operating: Half-sine, 1,000G @ 1ms, 6 directions |
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|
Vibration |
Operating: Random, 5Grms, 2~2,000Hz, 3 axes |
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|
Supply voltage |
3.3V±5% |
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Ripple / Noise |
≤100mV |
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