On July 9, the two-day Data Center Asia (DCA) 2026 concluded successfully in Hong Kong. As a flagship data center event in the Asia-Pacific region, DCA 2026 highlighted the latest developments in AI infrastructure and data center technologies.

Making its debut at DCA, Union Memory showcased its full-stack AI storage solutions, presenting a comprehensive portfolio spanning computing, storage, and AI-driven applications. The company also delivered a keynote speech, sharing practical experience and forward-looking insights into storage innovation.

As a premier data center event for the Asia-Pacific region, DCA builds on the legacy of the renowned U.S.-based Data Center World (DCW) and its global network. Focused on industry trends and technological innovation, the event is dedicated to advancing the data center ecosystem across Asia-Pacific.

This year’s exhibition attracted a diverse group of exhibitors and professional buyers from mainland China, Hong Kong SAR, Macao SAR, Taiwan, Japan, South Korea, Southeast Asia, India, the Middle East, Europe, and North America. From hyperscale operators and colocation providers to edge infrastructure architects, cloud strategists, and AI infrastructure pioneers, industry leaders came together to explore the latest trends and innovations shaping the future of data centers.

Comprehensive Portfolio, Seamless Coverage Across Every Scenario

Union Memory has ranked No. 3 in China’s enterprise SSD market and No. 1 among domestic vendors for four consecutive years. This market leadership is built on a comprehensive enterprise SSD portfolio spanning all three major interface standards—PCIe, SAS, and SATA.

At DCA 2026, Union Memory showcased its comprehensive product portfolio, supporting a wide range of workloads, from AI training and inference and high-performance computing (HPC) to warm and cold data storage and server boot applications.

Data Center Scenario: UH713a

UH713a, China’s first 8-channel enterprise SSD for data centers, combines intelligent algorithms with advanced firmware optimization to deliver an optimal balance of performance and energy efficiency, helping data centers optimize total cost of ownership (TCO).

High-Performance Computing Scenario: UH812c/UH832c

Built on a high-bandwidth PCIe Gen5 architecture, UH812c/UH832c delivers industry-leading throughput and ultra-low latency to maximize GPU performance and accelerate AI inference.

Rapid Deployment Scenario: UM301a

UM301a, an enterprise M.2 boot SSD, features a DRAM-less architecture that optimizes both power consumption and cost, improving deployment and operational efficiency for large-scale data centers.

Massive Data Scenario: UH802a

UH802a, an enterprise QLC SSD, delivers exceptional storage density and outstanding energy efficiency, enabling higher-capacity, cost-effective tiered storage for massive data workloads.

Keynote Speech: Storage Innovation and Challenges in the Era of AI Inference

At the forum “Driving Innovation in AI, Security and Infrastructure,” Union Memory delivered a keynote speech titled “Storage Innovation and Challenges in the Era of AI Inference.” The presentation highlighted that as AI shifts from model training to large-scale inference, data storage is facing unprecedented challenges and opportunities.

As AI enters the era of intelligent agents, the industry’s focus is shifting from model training to optimizing the cost, performance, and sustainability of KV cache. Against this backdrop, SSDs are rapidly evolving from traditional storage devices into intelligent engines that power AI computing.

Backed by its comprehensive enterprise SSD portfolio and in-house flash controller technology, Union Memory delivers end-to-end storage solutions spanning computing, storage, and AI workloads, providing a solid foundation for next-generation AI infrastructure.

Meanwhile, Union Memory is one of the few storage vendors with in-house advanced packaging and testing capabilities. The company has mastered the entire process, including package design, simulation, reliability validation, and advanced packaging and testing technologies, while delivering proven high-volume manufacturing capabilities for large-capacity, high-density, and ultra-thin system-in-package (SiP) solutions.

From flash controller development and firmware design to intelligent manufacturing and advanced packaging and testing, Union Memory has built an end-to-end technology stack with fully integrated in-house capabilities, providing a solid foundation for the next generation of AI inference.

Union Memory’s debut at DCA marks an important milestone in expanding its presence across the Asia-Pacific market. As a strategic gateway connecting the data center markets of Northeast and Southeast Asia, DCA Hong Kong provides an important platform for global enterprises seeking opportunities across the region.

Through its exhibition showcase and keynote presentation, Union Memory demonstrated the strength of China’s storage innovation and its full-stack technology portfolio to customers and industry partners across Asia-Pacific and beyond. Looking ahead, the company will continue to drive technological innovation and strengthen ecosystem collaboration, delivering reliable storage solutions that power the next generation of AI infrastructure.