From November 19 to 21, the 2025 Intel Technology Innovation and Industry Ecosystem Conference was grandly held at the Chongqing Yuelai International Conference Center. Union Memory deeply participated in this event as the first domestic SSD strategic partner of Intel Data Center and AI Business Unit (DCAI) in China. This also marks the second consecutive year that Union Memory has been invited to this globally influential technology event, signifying that the collaboration between the two parties has achieved a comprehensive leap from product compatibility and joint technology development to ecosystem co-construction.

During the conference, Union Memory, together with Intel, H3C and Envicool, jointly unveiled a dual-channel cold-plate full-coverage liquid-cooled server. Union Memory was also invited to deliver in-depth keynote presentations at "the IPDC Hardware Infrastructure and Ecosystem Forum" and "the Modern Data Center Liquid Cooling Technologies and Industry Chain Ecosystem Forum", fully demonstrating its technological leadership in the data center storage area.

Liquid-Cooling Synergy Breakthrough Redefines Data Center Energy Efficiency Benchmarks

At the Intel Technology Innovation and Industry Ecosystem Conference, Union Memory cooperated with Intel, H3C and Envicool to jointly launch a dual-channel cold-plate full-coverage liquid-cooled server based on Intel® Xeon® 6900-series processors with P-cores. This innovative solution achieves high-percentage liquid cooling coverage for critical heat sources, significantly reducing energy consumption and operating costs while improving reliability and energy efficiency, and setting a new benchmark for data center cooling and energy efficiency. The solution deeply integrates Union Memory UH812a liquid-cooled SSD, which serves as a key component in building an efficient liquid-cooling system and further strengthens overall thermal dissipation capability and energy efficiency performance.

Kou Pengtao, General Manager of Union Memory, said, "Union Memory SSD is a core component of the dual-channel cold-plate full-coverage liquid-cooled server. This application represents an important milestone for Union Memory in addressing the challenges of large-scale AI computing power. We will continue to deepen innovation with our partners, leveraging high-performance storage solutions to drive energy efficiency transformation in data centers and empower their green and efficient development."

Currently, the storage subsystem power consumption of a typical 24-bay server has exceeded 600W. Such concentrated thermal density pushes traditional air-cooling solutions to their limits. Cooling has become a core bottleneck restricting the continuous release of storage performance and further optimization of data center PUE. For example, the upper operating temperature limit for enterprise-grade media is 70°C, beyond which data reliability may be affected.

In response to this system-level challenge, Union Memory’s high-performance storage solutions have achieved full-chain optimization from chip to system. Coordinated innovation is carried out across five key levels: controller chip design, thermal management algorithms, storage component board-level design, enclosure structure, and system thermal design adaptation. Breakthroughs are achieved simultaneously in energy efficiency and cooling performance. This design ensures that storage devices can maintain stable high-performance output and ultra-low latency even under sustained full-load conditions, effectively avoiding performance fluctuations and reliability risks caused by overheating.

Co-building the AI Storage Ecosystem to Accelerate Full-Scenario Storage Performance Improvement

At the private session of the IPDC Hardware Infrastructure and Ecosystem Forum, Union Memory delivered a themed presentation titled "Unlocking AI Technology Challenges: Union Memory SSDs Build the Ultimate Storage Engine for the Intelligent Era", systematically elaborating on its collaborative strategy with Intel in the AI storage area.

As global demands for AI computing power grow exponentially, storage system has evolved from a background support role into a core link of AI efficiency. Union Memory actively addresses the stringent low-latency requirements imposed by massive AI data and the dual challenges of bandwidth and energy efficiency in the PCIe 5.0/6.0 era, continuously advancing the development and deployment of next-generation storage architectures.

 Union Memory cold-plate liquid-cooled SSDs significantly improve the contact efficiency between storage devices and cold plates through optimized drive structure and cooling design, achieving more efficient heat transfer. This not only significantly reduces data center energy consumption but also provides solid hardware-level support for sustainable development.

 Union Memory enterprise-grade M.2 boot drives feature ultra-fast data transfer, high energy efficiency, and a compact form, greatly shortening system boot time, and providing critical support for improving data center operation and maintenance efficiency and service responsiveness.

 Union Memory high-performance storage solutions represent the best practices for all-flash high-performance storage based on the Intel® Xeon® 6 processor platform and Union Memory UH812a SSD. Through dual-path optimization of kernel and SPDK, these solutions deliver outstanding I/O performance, and provide a robust data storage foundation for high-performance scenarios.

Looking into the future, Union Memory and Intel will continue to deepen their strategic collaboration in cutting-edge fields such as next-generation storage innovation and full-stack liquid cooling. To address the continuous evolution of scenarios including AI training and inference acceleration, both parties will jointly promote the advancement of storage infrastructure toward higher efficiency, reliability and sustainability through close software-hardware collaboration and system-level optimization, injecting new momentum into the digital transformation of various industries.